Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.
1～30 item / All 66 items
Non-contact measurement of the thickness of fiber membranes such as non-woven fabric - Sample measurement in progress -
Detecting thickness variations in nanofiber non-woven fabric using transmitted light - Non-contact real-time high-speed measurement - 3D display of fiber surface shape - Interchangeable fiber sensors tailored to the target
Non-destructive line measurement of film and sheet thickness.
First of all, each device component is designed to be simple, allowing us to introduce customized packaging that meets the needs of each customer, which is also optimal for cost reduction. We have adopted a highly reliable measurement calculation method called FFT, so you can collect data with confidence.
A film thickness measuring device designed not only for research purposes but also for use in production environments.
The "Film Thickness Measurement Device" is a product of THETA METRISIS, handled by Outex. It is a film thickness measurement system that uses white light reflection spectroscopy, capable of measuring from the nano range to the micron range. A variety of models are available to suit different applications, ranging from convenient portable types to large stationary types. We offer numerous modules necessary for measurements in high temperatures, in liquids, microscope attachment types, gas chambers, flow cells, and more. This product is designed not only for research purposes but also with an eye towards use in production environments. 【Features】 ■ Film thickness measurement system from nano range to micron range using white light reflection spectroscopy ■ A wide selection of models available to suit various applications ■ Numerous modules available ■ Usable in both research and production environments *For more details, please refer to the PDF document or feel free to contact us.
Automation is possible at various points! Instant measurement of copper film thickness and the potential for increased production efficiency through advanced statistical processing is here!
How about fully automated measurement for the inspection of copper plating film thickness? The handheld copper plating thickness measurement device "Cabidarm" can automate various points such as the plating process, final inspection process, and incoming inspection. 【Features】 ○ Measurements are taken instantly ○ The dedicated probe does not scratch the substrate ○ It is possible to connect to a PC via USB cable for advanced statistical processing For more details, please contact us or download the catalog.
No need for electrode formation with mercury probes! Provides reduced development time and lower costs in R&D.
The "MCV-530/530L/2200/2500" is a device that enables the evaluation of electrical characteristics of semiconductor silicon wafers and the characteristics of MOS device oxide films, among others. Traditionally, gate electrodes such as Poly-Si or Al were deposited on the wafer, and after forming MOS structures or Schottky structures, CV/IV characteristic evaluations were conducted. This product has its own gate electrode, allowing for the acquisition of electrical characteristics of oxide films and wafers without the need to create a metal gate. It provides quick feedback through process monitoring, reduces development time in R&D, and lowers costs. 【Features】 ■ No need for electrode formation due to the mercury probe ■ Excellent reproducibility ・Schottky: 0.3% (1σ) / MOS: 0.1% (1σ) ■ Mapping of the wafer surface is possible ■ Safe and easy mercury exchange enabled by a newly developed mercury exchange mechanism *For more details, please refer to the PDF document or feel free to contact us.
Function to measure surface and nano structures! Covers from millimeters to atomic level.
We introduce a combined system of Scanning Electron Microscope (SEM) and Atomic Force Microscope (AFM). Using the zoom function of the SEM, the AFM chip can be directly moved to the target area. Information about surface morphology and mechanical, electrical, and magnetic properties can be obtained with nanometer resolution. AFM can be utilized with the Merlin series and Crossbeam series, and existing systems can be updated with a simple door replacement. 【Features】 ■ SEM and FIB intersect with a cantilever chip ■ Composite measurements of all three methods can be performed at the exact same point in space and on the sample ■ Designed to achieve 3D resolution at the single atom level ■ Maintains a minimum SEM working distance of 5mm while allowing a viewing angle of 0° to 85° with the SEM ■ Supports in-situ chip sharpening with FIB *For more details, please refer to the PDF document or feel free to contact us.
Measurement device that enables the use of IR reflectance measurement heads! Achieves high-throughput measurement of epitaxial film thickness.
The "EIR-2500" is a unique epitaxial film thickness measurement device equipped with an infrared spectroscopic reflectometer and FTIR functionality. It achieves high-throughput epitaxial film thickness measurements and fully complies with applicable SEMI/CE standards. Additionally, the EIR product series is based on high-performance and reliable electronic components, improving equipment uptime and reducing maintenance needs. 【Features】 ■ Wafer size: 4 to 12 inches ■ Materials: Si, SOI, SiC, SiGe, III-V, etc. ■ FTIR functionality ■ High-precision measurement of epitaxial film thickness ■ Measurement of film thickness in the transition region *For more details, please refer to the related link page or feel free to contact us.
"Pioneer of carbon jigs" - Two examples of non-contact measuring devices from Akebono Seiki Kogyo.
From the design and production of three-dimensional labor-saving devices that incorporate semiconductor components into carbon (graphite) jigs from flat tools, we respond to our customers' needs as the "unsung heroes" behind the scenes.
No sample adjustment needed! You can measure the coated sample as it is.
The "Auto Crater" is a testing machine that measures film thickness by polishing samples with a rotating steel ball and measuring the polishing marks using optical microscopes and other methods. Sample preparation for cross-section creation, such as cutting, polishing, and resin embedding, is not required. The coated samples can be measured as they are. Additionally, by using chemical treatments to change the composition of the film, the thickness of each layer can be evaluated based on differences in color tone. 【Features】 ■ No sample preparation required ■ Direct measurement of coated samples ■ Evaluation of multilayer films possible ■ Fully domestically produced *For more details, please refer to the PDF materials or feel free to contact us.
It measures coating thickness non-destructively and without contact!
The measurement principle is similar to thermal reflection, where light is irradiated onto the object, and the time it takes for heat to propagate is converted into coating thickness. Measurements can be made regardless of specific materials or substances, and it is possible to measure both powders and liquids.
Cost-effective fastening with plastic nails.
◆Applicable Base Materials - Concrete - Lightweight concrete porous blocks - Vertical hole bricks - Hole-punched limestone bricks ◆Applications Fastening the following insulation materials to facades, etc.: - Polyurethane boards - Wood wool lightweight building material boards - Cork boards / coir mats - PU panels
Installation inside insulation to reduce heat bridges.
◆Applicable Base Materials - Bead method polystyrene foam (EPS) type - Extruded polystyrene foam (XPS) type - Wood fiber type - Rigid polyurethane foam type - Rock wool, etc. ◆Features - Dedicated fastening for direct installation to insulation materials, designed to reduce thermal bridging. - FID ii shape allows for easy installation without pre-drilling through a thin mortar layer, shortening the construction process. - FID ii is a high-load fastener specifically for insulation materials, suitable for insulation thicknesses starting from 60 mm, while FID ii Plus is for thicknesses starting from 100 mm. - Quick and economical installation using Torx T40.
An essential inspection tool that strongly supports the stabilization of device processes!
The "BMW-1200R" is an inspection tool that detects minute surface defects (such as chuck marks, discharge marks, dents, contact marks, etc.) occurring on the backside of wafers during the device manufacturing process with high sensitivity and speed. It quickly maps defect information that can lead to yield loss in subsequent processes such as exposure and CMP. Additionally, at the review station, three-dimensional automatic measurements of individual defects extracted from macro inspections are performed using a laser microscope, providing users with detailed data such as defect P-V values. 【Features】 ■ Full backside inspection (EE = 1mm) ■ Candidate defect extraction using image processing and masks ■ High throughput ■ Wide dynamic range ■ Automatic defect review and automatic 3D measurement *For more details, please refer to the catalog or feel free to contact us.
Business introduction of Kyushu Kett Co., Ltd., which provides various measuring instruments.
At Kyushu Kett Co., Ltd., many products are adopted by Japanese standard measuring instruments, and we serve as agents for Kett Scientific Research Institute, Nippon Denshoku Kogyo, and Isuzu Manufacturing, providing sales and maintenance of measuring instruments across various fields. Additionally, we also sell a wide range of physical and chemical instruments targeted at national and public research institutions. 【Sales Items】 ■ Measuring Instruments ■ Physical and Chemical Instruments *For more details, please download the PDF or feel free to contact us.
Maintains high precision and outstanding stability! Used in various fields and has gained immense trust.
We handle the "thickness measurement device" manufactured by Helmut Fischer. Because it is accurate, it helps reduce waste of paint. It can measure the correct purity of expensive materials such as gold and silver. It is non-contact, has a fast response time, and allows for continuous measurement. 【Features】 ■ Accurate, thus reducing "waste of paint" ■ Can measure the correct purity of "expensive materials" such as gold and silver ■ Non-contact with a fast response time, enabling continuous measurement ■ Easy to use and measurable by anyone *For more details, please refer to the PDF document or feel free to contact us.
We will match the inspection materials with the 3D data provided by the customer and check for differences in shape, thickness, and other aspects.
We would like to introduce the "non-contact measurement" conducted by Ito Mokugata Seisakusho. Using a non-contact measuring device, we measure the material and output it as point cloud data. We match the inspection material with the 3D data provided by the customer to check for differences in shape, thickness, and other aspects. For the 3D data, areas where the material is thick are shown in red, while areas that are thin are shown in blue, allowing for easy visual differentiation by changing colors based on the range. 【Features】 ■ Overlay measurement of data on a computer ■ Confirmation of misalignment, presence of shape, distortion, thickness, etc., through color and numerical values *For more details, please refer to the PDF document or feel free to contact us.
100V power supply specifications! A new measurement solution for evaluating next-generation power devices!
We offer the 'HALS-H II', which allows for easy measurement of the Hall effect in high-temperature environments anywhere and by anyone. This product can be used for the fundamental property evaluation of semiconductor materials such as power semiconductor materials, solar cell materials, and gas sensor materials. Please feel free to contact us if you have any inquiries. 【Features】 ■Low price ■High performance *For more details, please download the PDF or feel free to contact us.
R&D分野において利用出来る特長を兼ね備えた光干渉式膜厚測定装置！
『TohoSpec3100』は、ナノメトリクス社より技術移管された 光干渉式膜厚測定装置です。 多数の納入実績を誇る業界標準機で、測定再精度2Å以下を実現、 リニアアレー受光素子を採用。 高信頼性、高精度、高速をコンセプトとしており、多層膜同時測定や 光学定数(n,k)測定に利用可能です。 【特長】 ■スペクトル解析ソフトにより、多層膜（通常３層まで）の同時測定, 光学定数（n,k）の測定が可能 ■各種膜特性に適合したパラメータの設定ができ、 より豊富な各種膜構造の膜厚測定が可能 ■プロセスに適合した特殊膜測定用のプログラム設定が容易に実現可能 ■米国マイクロソフト社のWindows(R)7対応 ※詳しくはPDFをダウンロードして頂くか、お気軽にお問い合わせ下さい。
High-performance thickness gauge that meets the on-site needs for film thickness measurement.
Measurement of various products such as disks, printed circuit boards, and electronic devices is possible!
Eliminate the issues of film thickness measurement in the coating process!
High-performance film thickness inspection equipment that meets the on-site needs for plating thickness measurement.
USB Simple Film Thickness Measurement Device
It measures optical film thickness from 300nm to 30μm (100μm) with good reproducibility, which was not possible with conventional contact methods.
